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TIF100-50-11F Ultra-Soft Silicone Thermal pad on PC cooling

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TIF100-50-11F Ultra-Soft Silicone Thermal pad on PC cooling

Name: TIF1005011F UltraSoft Silicone Thermal pad on PC cooling
Brand: Ziitek
Price: 0.1 USD

Quality TIF100-50-11F Ultra-Soft Silicone Thermal pad on PC cooling wholesale

Brand Name : Ziitek

Model Number : TIF100-50-11F

Certification : UL and RoHs

Place of Origin : Vietnam

MOQ : 1000pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 100000pcs/day

Delivery Time : 3-5 work days

Packaging Details : 24*13*12cm cartons

Products name : TIF100-50-11F Ultra-Soft Silicone Thermal pad on PC cooling

Keywords : Silicone Thermal Pad

Thermal Conductivity : 5.0W/mK

Density : 3.15g/cc

Color : Dark Gray

Hardness : 60±5 Shore 00

Dielectric Breakdown Voltage : >5500VAC

Application : Notebook CPU GPU Chip

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TIF100-50-11F Ultra-Soft Silicone Thermal pad on PC cooling

Ziitek TIF™100-50-11F is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.

TIF100-50-11F Ultra-Soft Silicone Thermal pad on PC cooling

Features:

> Good thermal conductive: 5.0W/mK
> Good thermal conductivity
> Naturally tacky needing no furtheradhesive coating
> Soft and Compressible for low stressapplications
> Available in varies thickness

Applications:

> Semiconductor automated test equipment (ATE)
> Monitoring the Power Box
> AD-DC Power Adapters
> Rainproof LED Power
> Waterproof LED Power
> SMD LED module
> LED Flesible strip, LED bar
> LED Panel Light
> LED floor light
> Routers

Typical Properties of TIF100-50-11F Series
Property	Value	Test method
Color	Dark Gray	Visual
Construction & Compostion	Ceramic filled silicone elastomer	******
Density	3.15g/cc	ASTM D297
Thickness range	0.020"(0.5mm)~0.200"(5.0mm)	ASTM D374
Hardness	60±5 Shore 00	ASTM 2240
Continuos Use Temp	-40 to 160℃	******
Dielectric Breakdown Voltage	>5500 VAC	ASTM D149
Dielectric Constant	6.0 MHz	ASTM D150
Volume Resistivity(Ohm-cm)	1.0X10¹²	ASTM D257
Fire rating	94 V0	UL E331100
Thermal conductivity	5.0W/m-K	ASTM D5470

Products Thickness:
0.020 inch to 0.200 inch(0.5mm to 5.0mm)

Products Size:

8"*16"(203mm*406mm)
TIF™ series Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.

TIF100-50-11F Ultra-Soft Silicone Thermal pad on PC cooling

Company Profile

With professional R&D capabilities and over 19 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

FAQ

Q: Are you trading company or manufacturer ?

A: We are manufacturer in Vietnam.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

TIF100-50-11F Ultra-Soft Silicone Thermal pad on PC cooling Images

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