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VIETNAM ZIITEK TECHNOLOGY CO.,LTD Vietnam Ziitek Technology Company Limited
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TIF100-30-02 Ultra-Soft Silicone Thermal Conductive Gap Filler Pad

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TIF100-30-02 Ultra-Soft Silicone Thermal Conductive Gap Filler Pad

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Brand Name : Ziitek

Model Number : TIF100-30-02

Certification : UL and RoHs

Place of Origin : Vietnam

MOQ : 1000pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 100000pcs/day

Delivery Time : 3-5 work days

Packaging Details : 24*13*12cm cartons

Products name : Ultra-Soft Silicone Thermal Conductive Gap Filler Pad

Thermal Conductivity : 3.0W/mK

Density : 3.0g/cm³

Keywords : Thermal Pad

Color : Gray

Hardness : 45 Shore 00

Dielectric Breakdown Voltage : >5500VAC

Application : High speed mass storage drives

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TIF100-30-02 Ultra-Soft Silicone Thermal Conductive Gap filler Pad

The TIF™100-30-02 is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF100-30-02 is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.

TIF100-30-02 Ultra-Soft Silicone Thermal Conductive Gap Filler Pad

Features:


> Good thermal conductive: 3.0W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness

> RoHS compliant
> UL recognized
> Moldability for complex parts
> Naturally tacky needing no further adhesive coating


Applications:


> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
> IT infrastructure
> GPS navigation and other portable devices
> CD-Rom, DVD-Rom cooling
> LED Power Supply
> LED Controller
> LED Ceilinglamp

Typical Properties of TIF100-30-02 Series
Property Value Test method
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density 3.0g/cm³ ASTM D297
Thickness range 0.020"(0.5mm)~0.200"(5.0mm) ******
Hardness 45 Shore 00 ASTM 2240
Continuos Use Temp -40 to 160℃ ***
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 5.0 MHz ASTM D150
Volume Resistivity(Ohm-cm) 1.0X10¹² ASTM D257
Fire rating 94 V0 UL E331100
Thermal conductivity 3.0W/m-K ASTM D5470


Products Thickness:
0.020 inch to 0.200 inch(0.5mm to 5.0mm)

Products Size:

8"*16"(203mm*406mm)
TIF™ series Individual die cut shapes can be supplied.


Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.
TIF100-30-02 Ultra-Soft Silicone Thermal Conductive Gap Filler Pad
Company Profile

With professional R&D capabilities and over 19 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

Independent R&D team

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us

4. We will reply you as soon as possible with Email or online.


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TIF100-30-02 Ultra-Soft Silicone Thermal Conductive Gap Filler Pad Images

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