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TIF100-60-11F Thermal Silicone Pad For Heat Sink Cooling

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TIF100-60-11F Thermal Silicone Pad For Heat Sink Cooling

Name: TIF1006011F Thermal Silicone Pad For Heat Sink Cooling
Brand: Ziitek
Price: 0.1 USD

Quality TIF100-60-11F Thermal Silicone Pad For Heat Sink Cooling wholesale

Brand Name : Ziitek

Model Number : TIF100-60-11F

Certification : UL and RoHs

Place of Origin : Vietnam

MOQ : 1000pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 100000pcs/day

Delivery Time : 3-5 work days

Packaging Details : 24*13*12cm cartons

Products name : Thermal Silicone Pad For Heat Sink Cooling

Keywords : Thermal Silicone Pad

Thermal Conductivity : 6.0W/mK

Density : 3.25g/cc

Color : Gray

Hardness : 60 Shore 00

Dielectric Breakdown Voltage : 10.0K /VAC

Application : Heat Sink Cooling

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TIF100-60-11F Thermal Silicone Pad For Heat Sink Cooling

Ziitek TIF™100-60-11F use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

TIF100-60-11F Thermal Silicone Pad For Heat Sink Cooling

Features:

> Good thermal conductive: 6.0W/mK
> Good thermal conductivity
> Naturally tacky needing no furtheradhesive coating
> Soft and Compressible for low stressapplications
> Available in varies thickness

Applications:

> Semiconductor automated test equipment (ATE)
> Monitoring the Power Box
> AD-DC Power Adapters
> Rainproof LED Power
> Waterproof LED Power
> SMD LED module
> LED Flesible strip, LED bar
> LED Panel Light
> LED floor light
> Routers

Typical Properties of TIF100-60-11F Series
Property	Value	Test method
Color	Gray	Visual
Construction & Compostion	Ceramic filled silicone elastomer	******
Density	3.25g/cc	ASTM D297
Thickness range	0.020"(0.5mm)~0.200"(5.0mm)	ASTM D374
Hardness	60 Shore 00	ASTM 2240
Continuos Use Temp	-40 to 160℃	******
Dielectric Breakdown Voltage	10.0K VAC	ASTM D149
Dielectric Constant	6.0 MHz	ASTM D150
Volume Resistivity(Ohm-cm)	5.2X10¹³	ASTM D257
Fire rating	94 V0	UL E331100
Thermal conductivity	6.0W/m-K	ASTM D5470

Products Thickness:
0.020 inch to 0.200 inch(0.5mm to 5.0mm)

Products Size:

8"*16"(203mm*406mm)
TIF™ series Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.

Company Profile

Vietnam Ziitek Technology Company Limited is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

FAQ

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

TIF100-60-11F Thermal Silicone Pad For Heat Sink Cooling Images

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