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Brand Name : Ziitek
Model Number : TIF100-50-50E
Certification : UL and RoHs
Place of Origin : Vietnam
MOQ : 1000pcs
Price : 0.1-10 USD/PCS
Payment Terms : T/T
Supply Ability : 100000pcs/day
Delivery Time : 3-5 work days
Packaging Details : 24*13*12cm cartons
Products name : Good flexibility and fillability Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers
Application : AI Processors AI Servers
Thermal Conductivity : 5.0W/mK
Density : 3.3g/cm³
Dielectric Breakdown Voltage : >5500VAC
Color : Pink
Hardness : 35 Shore 00
Keywords : Thermally Gap Pad Filler
Good flexibility and fillability Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers
TIF®100-50-50E Series is a well-balanced, general-purpose thermal pad. It offers excellent thermal conductivity and moderate hardness. This balanced design provides both good surface conformity and excellent ease of use,making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.
Features:
> Good thermal conductive:5.0W/mK
> Available in varies thickness
> Good flexibility and fillability
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance
Applications:
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> AI Processors AI Servers
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure
| Typical Properties of TIF®100-50-50E Series | |||
| Property | Value | Test method | |
| Color | Pink | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.3 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.50) | (0.75~5.0) | ||
| Hardness | 65 Shore 00 | 35 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant | 9.0 MHz | ASTM D150 | |
| Volume Resistivity | >1.0X1012 Ohm-meter | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity | 5.0 W/m-K | ASTM D5470 | |
| 5.0 W/m-K | ISO22007 | ||
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16" X16" (406 mmX406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

With professional R&D capabilities and over 19 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.
Our services
Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries in English of course.
Standard Export Carton Or Marked With Customer's Information Or Customized.
Provide free samples
After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.
we will help you to deal with it and give you satisfactory solution.
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TIF100-50-50E Good flexibility and fillability Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers Images |